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XC7A200T-1FFG1156I - AMD

Description: Artix-7 Field Programmable Gate Array (FPGA) IC 500 13455360 215360 1156-BBGA, FCBGA

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XC7A200T-1FFG1156I - AMD PCB footprint - BGA - BGA - FFG1156
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XC7A200T-1FFG1156I - AMD  - 3D model - BGA - FFG1156
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XC7A200T-1FFG1156I Details

  • Manufacturer Part Number:

    XC7A200T-1FFG1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    500

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    500

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.1 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7A200T-1FFG1156I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A200T-1FFG1156I is dependent on the specific design and implementation, but it can operate up to 500 MHz.
  • The XC7A200T-1FFG1156I has a built-in memory interface generator (MIG) that can be used to implement a DDR3 memory interface. Xilinx provides a MIG wizard in the Vivado Design Suite to help with the implementation.
  • The power consumption of the XC7A200T-1FFG1156I depends on the specific design and implementation, but Xilinx provides power estimation tools in the Vivado Design Suite to help estimate power consumption.
  • The XC7A200T-1FFG1156I has a built-in PCIe endpoint block that can be used to implement a PCIe interface. Xilinx provides a PCIe core and a PCIe wizard in the Vivado Design Suite to help with the implementation.
  • The XC7A200T-1FFG1156I has GTX transceivers that can operate up to 12.5 Gbps, providing a maximum bandwidth of 100 Gbps.

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XC7A200T-1FFG1156I Overview

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Part Image XC7A200T-1FFV1156C AMD

Field Programmable Gate Array, 16825 CLBs, PBGA1156

Part Image XC7A200T-1FFG1156E AMD

Field Programmable Gate Array, 16825 CLBs, 1098MHz, 215360-Cell, PBGA1156

Part Image XC7A200T-1FFG1156I AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1098MHz, 215360-Cell, PBGA1156

Part Image XC7A200T-1FFV1156I AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 215360-Cell, PBGA1156

Part Image XC7A200T-1FFV1156C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, PBGA1156

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