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XC7A200T-2FBG484I - AMD

Description: XILINX - XC7A200T-2FBG484I - FPGA, Artix-7, MMCM, PLL, 285 I/O's, 628 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-484

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PCB Footprints
XC7A200T-2FBG484I - AMD PCB footprint - BGA - BGA - FB484, FBG484, and FBV484 Flip-Chip Lidless BGA Package Specifications for Kintex-7 FPGAs
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3D Models
XC7A200T-2FBG484I - AMD  - 3D model - BGA - FB484, FBG484, and FBV484 Flip-Chip Lidless BGA Package Specifications for Kintex-7 FPGAs
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XC7A200T-2FBG484I Details

  • Manufacturer Part Number:

    XC7A200T-2FBG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    285

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC7A200T-2FBG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A200T is 500 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates the necessary IP cores and interface logic.
  • The power consumption of XC7A200T varies depending on the operating frequency, voltage, and usage. However, the typical power consumption is around 10-15W.
  • Yes, XC7A200T is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault-tolerant features.
  • You can secure your design on XC7A200T using Xilinx's security features, such as bitstream encryption, authentication, and secure boot mechanisms.

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XC7A200T-2FBG484I Overview

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Part Image XC7A200T-2FBG484I AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484

Part Image XC7A200T-2FBG484C AMD

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484

Part Image XC7A200T-2FBG484C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484