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XC7A200T-L2FFG1156E - AMD

Description: IC FPGA 500 I/O 1156FCBGA

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PCB Footprints
XC7A200T-L2FFG1156E - AMD PCB footprint - BGA - BGA - FFG1156 2021
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3D Models
XC7A200T-L2FFG1156E - AMD  - 3D model - BGA - FFG1156 2021
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XC7A200T-L2FFG1156E Details

  • Manufacturer Part Number:

    XC7A200T-L2FFG1156E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Additional Feature:

    ALSO OPERATES AT 1V NOMINAL SUPPLY

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.51 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    500

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    500

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.1 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

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XC7A200T-L2FFG1156E Overview

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