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XC7A35T-1CSG324C - AMD

Description: Artix-7-FPGA

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XC7A35T-1CSG324C - AMD PCB footprint - BGA - BGA - CSG324
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XC7A35T-1CSG324C - AMD  - 3D model - BGA - CSG324
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XC7A35T-1CSG324C Details

  • Manufacturer Part Number:

    XC7A35T-1CSG324C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2600

  • Number of Inputs:

    210

  • Number of Logic Cells:

    33280

  • Number of Outputs:

    210

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A35T-1CSG324C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A35T is 500 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates a customized IP core for the DDR3 interface.
  • The power consumption of XC7A35T depends on the specific application and usage. However, the typical power consumption is around 1.5W to 2.5W. You can use the Xilinx Power Estimator (XPE) tool to estimate the power consumption for your specific design.
  • Yes, the XC7A35T is suitable for high-reliability applications. It is fabricated using a 28nm process and has undergone rigorous testing and qualification to ensure its reliability and performance.
  • You can secure your design on XC7A35T using the Xilinx Security features, such as bitstream encryption, authentication, and secure boot mechanisms. Additionally, you can use the Xilinx SecureIP tool to encrypt and obfuscate your IP cores.

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XC7A35T-1CSG324C Overview

Use the download button to access the XC7A35T-1CSG324C schematic symbol, PCB footprint, and 3D model.
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Part Image XC7A35T-1CSG324I AMD

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA324

Part Image XC7A35T-1CSG324I AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA324

Part Image XC7A35T-1CSG324C AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA324