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XC7A35T-2CSG324I - AMD

Description: FPGA - Field Programmable Gate Array XC7A35T-2CSG324I

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PCB Footprints
XC7A35T-2CSG324I - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7A35T-2CSG324I - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7A35T-2CSG324I Details

  • Manufacturer Part Number:

    XC7A35T-2CSG324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2600

  • Number of Inputs:

    210

  • Number of Logic Cells:

    33280

  • Number of Outputs:

    210

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A35T-2CSG324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A35T-2CSG324I is 500 MHz.
  • You can implement a DDR3 memory interface on the XC7A35T-2CSG324I using the MIG (Memory Interface Generator) tool in Vivado Design Suite. The tool generates a customized DDR3 memory controller and PHY interface.
  • Yes, the XC7A35T-2CSG324I is suitable for high-reliability applications. It is fabricated using a 28nm process and has a number of features that support high-reliability, such as built-in SEU (Single Event Upset) detection and correction, and support for triple modular redundancy (TMR).
  • To optimize power consumption on the XC7A35T-2CSG324I, you can use the Power Analyzer tool in Vivado Design Suite to analyze and optimize power consumption. You can also use techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling to reduce power consumption.
  • Yes, the XC7A35T-2CSG324I has a PCIe Gen3 endpoint block that supports x1, x4, and x8 lane configurations, making it suitable for PCIe applications.

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XC7A35T-2CSG324I Overview

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