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XC7A50T-1CPG236C - AMD

Description: Artix-7 Field Programmable Gate Array (FPGA) IC 106 2764800 52160 238-LFBGA, CSPBGA

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XC7A50T-1CPG236C - AMD PCB footprint - BGA - BGA - CPG236
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XC7A50T-1CPG236C - AMD  - 3D model - BGA - CPG236
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XC7A50T-1CPG236C Details

  • Manufacturer Part Number:

    XC7A50T-1CPG236C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-236

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B236

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4075

  • Number of Inputs:

    106

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    106

  • Number of Terminals:

    236

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA236,19X19,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

XC7A50T-1CPG236C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A50T-1CPG236C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, and use low-power modes. Additionally, optimize your design for minimal resource utilization and use the lowest possible voltage.
  • The -1 speed grade has a faster maximum clock frequency (350 MHz) compared to the -2 speed grade (250 MHz). The -1 speed grade is suitable for high-performance applications, while the -2 speed grade is more power-efficient.
  • The XC7A50T-1CPG236C has an industrial temperature range of -40°C to 100°C. However, it's essential to ensure proper cooling and thermal management to prevent overheating, especially in high-temperature environments.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core. The tool provides a wizard-based interface to configure and generate the IP core, which can then be integrated into your design.

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XC7A50T-1CPG236C Overview

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