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XC7A50T-2CSG324I - AMD

Description: XILINX - XC7A50T-2CSG324I - FPGA, Artix-7, MMCM, PLL, 150 I/O's, 628 MHz, 52160 Cells, 950 mV to 1.05 V, CSBGA-324

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XC7A50T-2CSG324I - AMD PCB footprint - BGA - BGA - CSG324 (Artix-7 FPGA)
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XC7A50T-2CSG324I - AMD  - 3D model - BGA - CSG324 (Artix-7 FPGA)
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XC7A50T-2CSG324I Details

  • Manufacturer Part Number:

    XC7A50T-2CSG324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4075

  • Number of Inputs:

    210

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    210

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A50T-2CSG324I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A50T is dependent on the specific design and implementation. However, Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
  • The XC7A50T has a built-in memory interface generator (MIG) that can be used to implement a DDR3 memory interface. Xilinx provides a MIG wizard in the Vivado Design Suite to help design and implement the interface.
  • The power consumption of the XC7A50T depends on the specific design, operating frequency, and usage. However, Xilinx provides a power estimator tool in the Vivado Design Suite to estimate the power consumption of a design. Typical power consumption for the XC7A50T is around 1-2 watts.
  • Yes, the XC7A50T is suitable for high-reliability applications. Xilinx provides a range of features and tools to support high-reliability design, including built-in error correction, single-event upset (SEU) mitigation, and fault-tolerant design flows.
  • Xilinx provides a range of security features and tools to help secure designs on the XC7A50T, including bitstream encryption, secure boot, and anti-tamper features. Additionally, Xilinx recommends using secure design practices, such as encrypting sensitive data and using secure communication protocols.

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XC7A50T-2CSG324I Overview

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Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA324

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Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA324