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XC7K160T-2FBG484I - AMD

Description: XILINX - XC7K160T-2FBG484I - FPGA, KINTEX-7 , 185 I/O, FCBGA-484

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PCB Footprints
XC7K160T-2FBG484I - AMD PCB footprint - BGA - BGA - FB484, FBG484, and FBV484 Flip-Chip Lidless BGA Package Specifications for Kintex-7 FPGAs
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3D Models
XC7K160T-2FBG484I - AMD  - 3D model - BGA - FB484, FBG484, and FBV484 Flip-Chip Lidless BGA Package Specifications for Kintex-7 FPGAs
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XC7K160T-2FBG484I Details

  • Manufacturer Part Number:

    XC7K160T-2FBG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    12675

  • Number of Inputs:

    285

  • Number of Logic Cells:

    162240

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    12675 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC7K160T-2FBG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K160T is 500 MHz.
  • You can implement DDR3 memory interface with XC7K160T using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • The power consumption of XC7K160T depends on the operating frequency, voltage, and usage. However, the typical power consumption is around 1.5W to 2.5W. You can use the Xilinx Power Estimator (XPE) tool to estimate the power consumption for your specific design.
  • Yes, XC7K160T is suitable for high-reliability applications. It is fabricated using a 28nm process and has built-in features such as error correction, CRC, and ECC to ensure data integrity.
  • You can optimize the design for area and speed with XC7K160T by using the Vivado Design Suite, which provides various optimization techniques such as pipelining, retiming, and resource sharing. Additionally, you can use the Xilinx Synthesis and Implementation tools to optimize the design.

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XC7K160T-2FBG484I Overview

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Image Part Number Model
Part Image XC7K160T-2FB484C AMD

Field Programmable Gate Array, 12675 CLBs, 1818MHz, 162240-Cell, CMOS, PBGA484

Part Image XC7K160T-2FB484I AMD Xilinx

Field Programmable Gate Array, 1818MHz, 162240-Cell, CMOS, PBGA484

Part Image XC7K160T-2FBG484E AMD Xilinx

Field Programmable Gate Array, PBGA484

Part Image XC7K160T-2FB484C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 162240-Cell, CMOS, PBGA484

Part Image XC7K160T-2FBV484C AMD Xilinx

Field Programmable Gate Array, 12675 CLBs, PBGA484

For a full list of alternate parts for XC7K160T-2FBG484I, check out Findchips.com