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XC7K480T-2FFG1156C - AMD

Description: IC FPGA 400 I/O 1156FCBGA

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PCB Footprints
XC7K480T-2FFG1156C - AMD PCB footprint - BGA - BGA - FFG1156_2021
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XC7K480T-2FFG1156C - AMD  - 3D model - BGA - FFG1156_2021
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XC7K480T-2FFG1156C Details

  • Manufacturer Part Number:

    XC7K480T-2FFG1156C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    37325

  • Number of Inputs:

    400

  • Number of Logic Cells:

    477760

  • Number of Outputs:

    400

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    85 °C

  • Organization:

    37325 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7K480T-2FFG1156C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K480T-2FFG1156C is 500 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates IP cores and example designs for DDR3 interfaces.
  • The power consumption of the XC7K480T-2FFG1156C depends on the specific design and usage. However, according to the datasheet, the typical static power consumption is around 2.5W, and the dynamic power consumption can range from 10W to 20W depending on the clock frequency and activity.
  • Yes, the XC7K480T-2FFG1156C is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications. It has undergone rigorous testing and qualification to ensure its reliability and performance.
  • Xilinx provides various security features, such as bitstream encryption, secure boot, and anti-tamper features, to help secure your design on the XC7K480T-2FFG1156C. You can also use third-party IP cores and tools to enhance security.

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XC7K480T-2FFG1156C Overview

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Image Part Number Model
Part Image XC7K480T-2FF1156I AMD

Field Programmable Gate Array, 37325 CLBs, 1818MHz, 477760-Cell, CMOS, PBGA1156

Part Image XC7K480T-2FF1156C AMD

Field Programmable Gate Array, 37325 CLBs, 1818MHz, 477760-Cell, CMOS, PBGA1156

Part Image XC7K480T-2FFG1156C AMD Xilinx

Field Programmable Gate Array, 37325 CLBs, 1286MHz, 477760-Cell, CMOS, PBGA1156

Part Image XC7K480T-2FFG1156I AMD Xilinx

Field Programmable Gate Array, 37325 CLBs, 1286MHz, 477760-Cell, CMOS, PBGA1156

Part Image XC7K480T-2FFV1156I AMD Xilinx

Field Programmable Gate Array, 37325 CLBs, PBGA1156

For a full list of alternate parts for XC7K480T-2FFG1156C, check out Findchips.com