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XC7SHU04GW,125 - Nexperia

Description: Inverter

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XC7SHU04GW,125 - Nexperia - PCB symbol
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PCB Footprints
XC7SHU04GW,125 - Nexperia PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT353-1
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3D Models
XC7SHU04GW,125 - Nexperia - 3D model - SOT23 (5-Pin) - SOT353-1
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XC7SHU04GW,125 Details

  • Manufacturer Part Number:

    XC7SHU04GW,125

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT353-1

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Family:

    AHC/VHC/H/U/V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.05 mm

  • Logic IC Type:

    INVERTER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    13 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

XC7SHU04GW,125 Frequently Asked Questions (FAQs)

  • Nexperia recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • Nexperia recommends operating the device within the specified temperature range (-40°C to 125°C). Ensure proper thermal design, and consider using thermal interface materials (TIMs) to reduce thermal resistance. Also, follow the recommended power-on sequencing and voltage ramp-up times to prevent thermal stress.
  • The XC7SHU04GW,125 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use ESD-safe materials, and consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • The XC7SHU04GW,125 is not specifically designed or tested for radiation-hardened applications. If radiation hardness is required, Nexperia recommends using their radiation-hardened products or consulting with their application engineers for guidance.
  • Nexperia recommends following the JEDEC J-STD-020D.1 standard for soldering profiles. The recommended peak temperature is 260°C, with a maximum time above 217°C of 60 seconds.

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XC7SHU04GW,125 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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