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XC7VX415T-2FFG1158I - AMD

Description: Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA

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XC7VX415T-2FFG1158I - AMD PCB footprint - BGA - BGA - FFG1158
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XC7VX415T-2FFG1158I Details

  • Manufacturer Part Number:

    XC7VX415T-2FFG1158I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1158

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B1158

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    32200

  • Number of Inputs:

    350

  • Number of Logic Cells:

    412160

  • Number of Outputs:

    350

  • Number of Terminals:

    1158

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32200 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS; 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7VX415T-2FFG1158I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XC7VX415T-2FFG1158I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • You can use an external POR circuit or the internal POR circuitry. For the internal POR, connect the PROGRAM_B pin to a pull-up resistor and a capacitor to ensure a reliable reset. Consult the Xilinx UG470 (Virtex-7 FPGA PCB Design and Pin Planning Guide) for more details.
  • Follow the guidelines in the Xilinx UG470 (Virtex-7 FPGA PCB Design and Pin Planning Guide) for PCB layout and routing. This includes using a solid ground plane, decoupling capacitors, and controlled impedance routing for high-speed signals.
  • Use a combination of techniques such as differential signaling, shielding, and termination. Also, follow the Xilinx guidelines for signal integrity and EMI reduction in the UG470 (Virtex-7 FPGA PCB Design and Pin Planning Guide).
  • The recommended settings for clocking and PLLs depend on the specific application and design requirements. Consult the Xilinx Clocking Wizard and the Virtex-7 FPGA Clocking Guide (UG472) for guidance on configuring the clocking and PLLs.

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XC7VX415T-2FFG1158I Overview

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