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XC7VX690T-3FFG1927E - AMD

Description: XILINX - XC7VX690T-3FFG1927E - FPGA, Virtex-7, MMCM, PLL, 600 I/O's, 741 MHz, 693120 Cells, 970 mV to 1.03 V, FCBGA-1927

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XC7VX690T-3FFG1927E - AMD PCB footprint - BGA - BGA - FFG1927
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XC7VX690T-3FFG1927E - AMD  - 3D model - BGA - FFG1927
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XC7VX690T-3FFG1927E Details

  • Manufacturer Part Number:

    XC7VX690T-3FFG1927E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1927

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.58 ns

  • JESD-30 Code:

    S-PBGA-B1927

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    54150

  • Number of Inputs:

    600

  • Number of Logic Cells:

    693120

  • Number of Outputs:

    600

  • Number of Terminals:

    1927

  • Operating Temperature-Max:

    100 °C

  • Organization:

    54150 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1924,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.65 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    45 mm

XC7VX690T-3FFG1927E Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7VX690T-3FFG1927E is 550 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, which provides a pre-verified and optimized implementation. Additionally, follow the Xilinx DDR3 memory interface user guide and application notes for specific design guidelines and best practices.
  • Use the Xilinx Vivado Design Suite to analyze and optimize signal integrity. Implement proper PCB design practices, such as using differential pairs, adding termination resistors, and minimizing signal routing distances. Additionally, use the FPGA's built-in features, such as input/output delay calibration and signal conditioning, to improve signal quality.
  • The XC7VX690T-3FFG1927E has limitations on resource utilization, such as the number of available logic cells, block RAM, and DSP slices. Carefully plan and optimize your design to ensure efficient resource utilization, and consider using resource-intensive IP cores or third-party IP to minimize FPGA resource usage.

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XC7VX690T-3FFG1927E Overview

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