XC7Z007S-1CLG225I - AMD

XC7Z007S-1CLG225I Details

• Manufacturer Part Number:

  XC7Z007S-1CLG225I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  CSBGA-225

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• YTEOL:

  14

• JESD-30 Code:

  S-PBGA-B225

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  225

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA225,15X15,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.5 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  13 mm

• uPs/uCs/Peripheral ICs Type:

  SoC