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XC7Z007S-1CLG400C - AMD

Description: XILINX - XC7Z007S-1CLG400C - PSOC, ARM CORTEX-A9, 667MHZ, BGA-400

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XC7Z007S-1CLG400C - AMD - PCB symbol
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PCB Footprints
XC7Z007S-1CLG400C - AMD PCB footprint - BGA - BGA - CLG400
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XC7Z007S-1CLG400C - AMD - 3D model - BGA - CLG400
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XC7Z007S-1CLG400C Details

  • Manufacturer Part Number:

    XC7Z007S-1CLG400C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-400

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • JESD-30 Code:

    S-PBGA-B400

  • JESD-609 Code:

    e3

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XC7Z007S-1CLG400C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7Z007S-1CLG400C is 350 MHz.
  • You can implement a DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • The power consumption of the XC7Z007S-1CLG400C depends on the specific application and usage. However, the typical power consumption is around 1.5W to 2.5W.
  • Yes, the XC7Z007S-1CLG400C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its ruggedized design and compliance with various industry standards.
  • To optimize the XC7Z007S-1CLG400C for low power consumption, use techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use the Xilinx Power Analyzer tool to identify and optimize power-hungry areas of the design.

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XC7Z007S-1CLG400C Overview

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