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XC8102AA01NR-G - Torex

Description: Power Switch ICs - Power Distribution 200mA Loard Switch with CL Discharge Built-in

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PCB Footprints
XC8102AA01NR-G - Torex PCB footprint - Other - Other - SSOT-24_2024-2
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3D Models
XC8102AA01NR-G - Torex  - 3D model - Other - SSOT-24_2024-2
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XC8102AA01NR-G Details

  • Manufacturer Part Number:

    XC8102AA01NR-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOT-24, 4 PIN

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Torex Semiconductor LTD

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT; OVER CURRENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Peak Current Limit-Nom:

    0.48 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOT-343R

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    6 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Turn-off Time:

    7.5 µs

  • Turn-on Time:

    18 µs

  • Width:

    1.25 mm

XC8102AA01NR-G Frequently Asked Questions (FAQs)

  • Torex recommends a compact PCB layout with minimal trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a solid ground plane is recommended. Additionally, place the input and output capacitors close to the IC and use a thermal via under the IC to improve heat dissipation.
  • To ensure stability, use a minimum output capacitance of 1uF with an ESR of 100mΩ or less. Additionally, place a 10nF ceramic capacitor in parallel with the output capacitor to filter high-frequency noise. Avoid using tantalum or electrolytic capacitors as they may cause oscillations.
  • The maximum ambient temperature for reliable operation of XC8102AA01NR-G is 85°C. However, the IC can operate up to 105°C with derating. It's essential to ensure proper heat dissipation and thermal management to prevent overheating.
  • Yes, XC8102AA01NR-G is designed to operate in high-vibration environments. However, it's essential to ensure the IC is properly mounted and secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment.
  • To troubleshoot output voltage issues, check the input voltage, output capacitor, and PCB layout. Verify that the input voltage is within the recommended range, and the output capacitor meets the recommended specifications. Also, check for any signs of overheating, such as excessive temperature or thermal shutdown.

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XC8102AA01NR-G Overview

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