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XC95144XL-7TQG144I - AMD

Description: CPLD - Circuits logiques programmables complexes 3.3V 144-mc CPLD

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PCB Footprints
XC95144XL-7TQG144I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQG144
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3D Models
XC95144XL-7TQG144I - AMD  - 3D model - Quad Flat Packages - TQG144
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XC95144XL-7TQG144I Details

  • Manufacturer Part Number:

    XC95144XL-7TQG144I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, TQFP-144

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    138.88 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    117

  • Number of Inputs:

    117

  • Number of Macro Cells:

    144

  • Number of Outputs:

    117

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 117 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC95144XL-7TQG144I Frequently Asked Questions (FAQs)

  • The recommended PCB layout and routing strategy for the XC95144XL-7TQG144I can be found in the Xilinx PCB Designer's Guide (UG583) and the Xilinx FPGAs PCB Design and Signal Integrity Guidelines (WP272). These documents provide guidelines for signal integrity, power distribution, and thermal management.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Xilinx-recommended XC6210, which monitors the power supply voltage and generates a reset signal when the voltage is below a certain threshold. The POR circuit should also include a capacitor to filter out noise and ensure a clean reset signal.
  • The XC95144XL-7TQG144I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Xilinx provides thermal management guidelines in the Xilinx FPGAs PCB Design and Signal Integrity Guidelines (WP272) and the Xilinx Thermal Management Guide (UG586).
  • Optimizing the clock tree involves using the Xilinx Clock Wizard tool to generate a clock tree with minimal skew and jitter. This can be achieved by using a hierarchical clock tree structure, placing clock buffers strategically, and using the Xilinx-recommended clocking architecture. Additionally, it's essential to follow the Xilinx Clocking Guidelines (UG472) and to use the Xilinx Vivado Design Suite to analyze and optimize the clock tree.
  • A reliable and efficient configuration interface can be implemented using a serial configuration interface, such as the Xilinx-recommended Slave Serial (SS) interface. It's essential to follow the Xilinx Configuration Guidelines (UG470) and to use the Xilinx Vivado Design Suite to generate the configuration data and implement the configuration interface.

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XC95144XL-7TQG144I Overview

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