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XCAU10P-2UBVA368E - AMD

Description: FPGA - Field Programmable Gate Array XCAU10P-2UBVA368E

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XCAU10P-2UBVA368E - AMD PCB footprint - BGA - BGA - XCAU10P-1UBVA368E
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XCAU10P-2UBVA368E - AMD  - 3D model - BGA - XCAU10P-1UBVA368E
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XCAU10P-2UBVA368E Details

  • Manufacturer Part Number:

    XCAU10P-2UBVA368E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-368

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B368

  • Length:

    11.5 mm

  • Number of CLBs:

    5500

  • Number of Inputs:

    128

  • Number of Logic Cells:

    96250

  • Number of Outputs:

    128

  • Number of Terminals:

    368

  • Operating Temperature-Max:

    100 °C

  • Organization:

    5500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA368,18X22,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    0.692 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Bismuth/Copper/Nickel (Sn/Ag/Bi/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9.5 mm

XCAU10P-2UBVA368E Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the Xilinx Ultrascale+ family, which includes the XCAU10P-2UBVA368E. The guide recommends a 4-layer PCB stackup with a dedicated power plane, decoupling capacitors, and thermal vias for heat dissipation. Additionally, AMD suggests using a heat sink or heat spreader to maintain a junction temperature below 85°C.
  • To optimize power consumption, use the AMD-provided power estimator tool to estimate power consumption based on your design's specific requirements. Implement power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption. For power noise reduction, use a multi-layer PCB with a dedicated power plane, decoupling capacitors, and a low-ESR capacitor on the power supply lines.
  • The recommended PLL settings depend on the specific clocking requirements of your design. AMD provides a clocking architecture guide that outlines the recommended settings for the PLL, including the clock frequency, clock jitter, and PLL bandwidth. It's essential to follow the guide to ensure proper clocking and minimize clock skew.
  • To ensure signal integrity, use a signal integrity analysis tool to simulate and analyze the signal behavior in your design. Implement differential signaling, use controlled impedance traces, and add signal termination resistors to minimize signal reflection and degradation. Additionally, use a PCB material with low dielectric loss and follow the AMD-recommended PCB layout guidelines.
  • To implement and verify the security features of the XCAU10P-2UBVA368E, follow the AMD-provided security guide, which outlines the recommended practices for implementing secure boot, secure firmware updates, and secure data storage. Use the AMD-provided security IP cores and follow the guidelines for secure key management and encryption.

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XCAU10P-2UBVA368E Overview

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Part Image XCAU10P-2UBVA368E AMD Xilinx

Field Programmable Gate Array, 96250-Cell, PBGA368