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XCAU15P-1FFVB676E - AMD

Description: FPGA - Field Programmable Gate Array XCAU15P-1FFVB676E

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XCAU15P-1FFVB676E - AMD PCB footprint - BGA - BGA - FFVB676
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XCAU15P-1FFVB676E - AMD  - 3D model - BGA - FFVB676
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XCAU15P-1FFVB676E Details

  • Manufacturer Part Number:

    XCAU15P-1FFVB676E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B676

  • Length:

    27 mm

  • Number of CLBs:

    9720

  • Number of Inputs:

    228

  • Number of Logic Cells:

    170100

  • Number of Outputs:

    228

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Organization:

    9720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

XCAU15P-1FFVB676E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCAU15P-1FFVB676E is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • To optimize power consumption, ensure that the device is operated within the recommended voltage range (0.95V to 1.05V), use power-saving features like clock gating and dynamic voltage frequency scaling, and implement efficient power management techniques in your design.
  • For optimal performance and signal integrity, follow AMD's recommended PCB layout guidelines, including using a 4-layer PCB, placing decoupling capacitors close to the device, and using controlled impedance traces for high-speed signals.
  • Use AMD's debugging tools and software, such as the AMD Debug Probe and the Xilinx Vivado Design Suite, to identify and troubleshoot issues. Also, consult the datasheet and application notes for guidance on debugging and troubleshooting common issues.
  • Store the XCAU15P-1FFVB676E in a dry, cool place, away from direct sunlight and moisture. Handle the device by the edges, avoiding touching the pins or electrical contacts, and use anti-static packaging and materials to prevent damage from electrostatic discharge.

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XCAU15P-1FFVB676E Overview

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