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XCKU115-2FLVF1924I - AMD

Description: FPGA - Field Programmable Gate Array XCKU115-2FLVF1924I

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XCKU115-2FLVF1924I - AMD PCB footprint - BGA - BGA - flvd1924
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XCKU115-2FLVF1924I - AMD  - 3D model - BGA - flvd1924
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XCKU115-2FLVF1924I Details

  • Manufacturer Part Number:

    XCKU115-2FLVF1924I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-1924

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1924

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5520

  • Number of Inputs:

    832

  • Number of Logic Cells:

    1451100

  • Number of Outputs:

    832

  • Number of Terminals:

    1924

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5520 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1924,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.13 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    45 mm

XCKU115-2FLVF1924I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU115-2FLVF1924I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU115-2FLVF1924I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • No, the XCKU115-2FLVF1924I is not a radiation-hardened device. If you need a radiation-hardened FPGA, consider using AMD's QPro or RT Pro devices, which are designed for high-reliability applications.
  • To ensure signal integrity, follow the Xilinx PCB Design Guide, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Signal Integrity Tool (SIT) to analyze and optimize your design.

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XCKU115-2FLVF1924I Overview

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Part Image XCKU115-2FLVD1924I AMD Xilinx

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Part Image XCKU115-2FLVF1924I AMD Xilinx

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