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XCKU15P-1FFVA1156E - AMD

Description: XILINX - XCKU15P-1FFVA1156E - FPGA, Kintex UltraScale+, 522720 Blocks, 1143450 Macrocells, 34600Kbit RAM, 0.85V Core, FCBGA-1156

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PCB Footprints
XCKU15P-1FFVA1156E - AMD PCB footprint - BGA - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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3D Models
XCKU15P-1FFVA1156E - AMD  - 3D model - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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XCKU15P-1FFVA1156E Details

  • Manufacturer Part Number:

    XCKU15P-1FFVA1156E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    65340

  • Number of Inputs:

    668

  • Number of Logic Cells:

    1143450

  • Number of Outputs:

    668

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Organization:

    65340 CLBs

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.71 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XCKU15P-1FFVA1156E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU15P-1FFVA1156E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the Xilinx Vivado Design Suite's power optimization features.
  • The maximum operating temperature of the XCKU15P-1FFVA1156E is 100°C (industrial grade) or 125°C (extended industrial grade), depending on the specific device grade.
  • To ensure signal integrity, follow the Xilinx PCB design guidelines, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Vivado Design Suite's signal integrity analysis tools to identify potential issues.
  • The maximum clock frequency supported by the XCKU15P-1FFVA1156E is 500 MHz, but it can vary depending on the specific device speed grade and the design's clocking architecture.

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XCKU15P-1FFVA1156E Overview

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Part Image XCKU15P-1FFVA1156I AMD Xilinx

Field Programmable Gate Array, 65340 CLBS, 1143450-Cell, PBGA1156