XCKU3P-1FFVD900I - AMD

XCKU3P-1FFVD900I Details

• Manufacturer Part Number:

  XCKU3P-1FFVD900I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  BGA-900

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• YTEOL:

  10

• JESD-30 Code:

  S-PBGA-B900

• JESD-609 Code:

  e1

• Length:

  31 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  20340

• Number of Inputs:

  304

• Number of Logic Cells:

  355950

• Number of Outputs:

  304

• Number of Terminals:

  900

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  20340 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA900,30X30,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  3.42 mm

• Supply Voltage-Max:

  0.876 V

• Supply Voltage-Min:

  0.825 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Technology:

  16 nm

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  31 mm