- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for XCKU5P-2FFVD900I
- Part Number XCKU5P-2FFVD900I
- Manufacturer AMD
- Pin Count 900
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
- Released Date May 6, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XCKU5P-2FFVD900I Details
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Manufacturer Part Number:
XCKU5P-2FFVD900I
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
BGA-900
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Country Of Origin:
Taiwan
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HTS Code:
8542.31.00.60
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
10
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JESD-30 Code:
S-PBGA-B900
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JESD-609 Code:
e1
XCKU5P-2FFVD900I Frequently Asked Questions (FAQs)
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The maximum power consumption of the XCKU5P-2FFVD900I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
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The maximum operating temperature of the XCKU5P-2FFVD900I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
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To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in signal integrity features, such as deskew and phase alignment, to minimize signal degradation.
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The maximum clock frequency supported by the XCKU5P-2FFVD900I is 500 MHz, but it can vary depending on the specific device grade, operating conditions, and design implementation.
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XCKU5P-2FFVD900I Overview
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