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XCR3064XL-10VQ100C - AMD

Description: CPLD - Complex Programmable Logic Devices XCR3064XL-10VQ100C

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XCR3064XL-10VQ100C - AMD - PCB symbol
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XCR3064XL-10VQ100C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQ100
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XCR3064XL-10VQ100C - AMD - 3D model - Quad Flat Packages - VQ100
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XCR3064XL-10VQ100C Details

  • Manufacturer Part Number:

    XCR3064XL-10VQ100C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    95 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    68

  • Number of Inputs:

    68

  • Number of Macro Cells:

    64

  • Number of Outputs:

    68

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 68 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

XCR3064XL-10VQ100C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCR3064XL-10VQ100C is -40°C to 100°C (industrial grade) and 0°C to 70°C (commercial grade).
  • Clock signal routing for the XCR3064XL-10VQ100C requires careful planning to minimize skew and jitter. AMD recommends using a dedicated clock tree with a single clock source and using the device's built-in clock buffering and routing resources.
  • The recommended power-up sequence for the XCR3064XL-10VQ100C is to apply power to the VCCINT and VCCAUX pins simultaneously, followed by the VCCO pin. Ensure that the power supply voltage is within the recommended range and that the power-up sequence is monotonic.
  • To optimize the XCR3064XL-10VQ100C for low power consumption, use the device's power-saving features such as clock gating, dynamic voltage and frequency scaling, and power-down modes. Additionally, optimize the design to minimize switching activity, use low-power I/O standards, and reduce the number of active resources.
  • The internal oscillator of the XCR3064XL-10VQ100C has limitations in terms of frequency accuracy, stability, and jitter. It is recommended to use an external clock source for critical applications or those requiring high-frequency clock signals.

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XCR3064XL-10VQ100C Overview

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Part Image XCR3064XL-10VQ100C AMD Xilinx

EE PLD, 10ns, 64-Cell, CMOS, PQFP100