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XCVC1902-2MSEVSVA2197 - AMD

Description: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1.9M Logic Cells 600MHz, 1.4GHz 2197-FCBGA (45x45)

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PCB Footprints
XCVC1902-2MSEVSVA2197 - AMD PCB footprint - BGA - BGA - VSVA2197
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3D Models
XCVC1902-2MSEVSVA2197 - AMD  - 3D model - BGA - VSVA2197
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XCVC1902-2MSEVSVA2197 Details

  • Manufacturer Part Number:

    XCVC1902-2MSEVSVA2197

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-2197

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    AMD

  • JESD-30 Code:

    S-PBGA-B2197

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Number of Terminals:

    2197

  • Operating Temperature-Max:

    110 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA2197,47X47,36

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Seated Height-Max:

    4 mm

  • Supply Voltage-Max:

    0.825 V

  • Supply Voltage-Min:

    0.775 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.92 mm

  • Terminal Position:

    BOTTOM

  • Width:

    45 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCVC1902-2MSEVSVA2197 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7V1902T-2MSEVSVA2197 is 500 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage frequency scaling, and optimize your design for low power consumption.
  • Follow Xilinx's PCB design guidelines, use a 4-layer or 6-layer PCB, and ensure proper signal integrity, decoupling, and thermal management. Consult the Xilinx documentation and application notes for specific guidance.
  • Use a reliable configuration memory, ensure proper power sequencing, and implement a robust boot-up sequence. Consult the Xilinx documentation and application notes for specific guidance on configuration and boot-up.
  • Ensure proper heat sink design, thermal interface material selection, and airflow management. Consult the Xilinx documentation and thermal management guidelines for specific guidance.

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XCVC1902-2MSEVSVA2197 Overview

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