XCVC1902-2MSEVSVD1760 - AMD

XCVC1902-2MSEVSVD1760 Details

• Manufacturer Part Number:

  XCVC1902-2MSEVSVD1760

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-1760

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  21 Weeks

• Manufacturer:

  AMD

• Application:

  Machine Learning; AI Inference

• Architecture:

  Versal

• JESD-30 Code:

  S-PBGA-B1760

• Number of Functions:

  1

• Number of Terminals:

  1760

• On Chip Memory Type:

  SRAM

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Packing Method:

  TRAY

• Surface Mount:

  YES

• Terminal Form:

  BALL

• Terminal Position:

  BOTTOM