XCVP1502-3HSEVSVA2785 - AMD

XCVP1502-3HSEVSVA2785 Details

• Manufacturer Part Number:

  XCVP1502-3HSEVSVA2785

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active Unconfirmed

• Package Description:

  FCBGA-2785

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B2785

• Length:

  50 mm

• Number of Terminals:

  2785

• Operating Temperature-Max:

  100 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HBGA

• Package Equivalence Code:

  BGA2785,53X53,36

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, HEAT SINK/SLUG

• Seated Height-Max:

  4.48 mm

• Supply Voltage-Max:

  0.906 V

• Supply Voltage-Min:

  0.854 V

• Supply Voltage-Nom:

  0.88 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.92 mm

• Terminal Position:

  BOTTOM

• Width:

  50 mm

• uPs/uCs/Peripheral ICs Type:

  SoC