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XCVU095-2FFVA2104E - AMD

Description: Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.

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XCVU095-2FFVA2104E - AMD PCB footprint - BGA - BGA - FFVA2104
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XCVU095-2FFVA2104E - AMD  - 3D model - BGA - FFVA2104
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XCVU095-2FFVA2104E Details

  • Manufacturer Part Number:

    XCVU095-2FFVA2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • JESD-609 Code:

    e1

  • Length:

    47.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    768

  • Number of Inputs:

    832

  • Number of Logic Cells:

    1176000

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    768 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.86 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    47.5 mm

XCVU095-2FFVA2104E Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in their documentation, including the Xilinx PCB Design Guide (UG583) and the Vivado Design Suite User Guide (UG903). Additionally, AMD offers a PCB Stackup Planner tool to help designers optimize their board layout.
  • AMD provides power estimation and thermal management guidelines in their documentation, including the XCVU095 Power Estimation and Thermal Management Application Note (XAPP1343). Designers can also use the Vivado Power Analysis tool to estimate power consumption and optimize their design.
  • AMD provides clocking and reset guidelines in their documentation, including the 7 Series FPGAs Clocking Resources User Guide (UG472) and the Vivado Design Suite User Guide (UG903). Designers should also consult the XCVU095 Clocking and Reset Application Note (XAPP1344) for specific recommendations.
  • AMD provides configuration and boot guidelines in their documentation, including the 7 Series FPGAs Configuration User Guide (UG470) and the Vivado Design Suite User Guide (UG903). Designers should also consult the XCVU095 Configuration and Boot Application Note (XAPP1345) for specific recommendations.
  • AMD provides guidelines and limitations for using the high-speed transceivers in their documentation, including the 7 Series FPGAs Transceivers User Guide (UG476) and the Vivado Design Suite User Guide (UG903). Designers should also consult the XCVU095 Transceiver Application Note (XAPP1346) for specific recommendations.

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XCVU095-2FFVA2104E Overview

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Part Image XCVU095-2FFVA2104E AMD Xilinx

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Part Image XCVU095-2FFVC2104I AMD Xilinx

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Part Image XCVU095-2FFVA2104I AMD Xilinx

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