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XCVU11P-2FLGF1924E - AMD

Description: package: FLGF1924

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PCB Footprints
XCVU11P-2FLGF1924E - AMD PCB footprint - BGA - BGA - FLGF1924
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3D Models
XCVU11P-2FLGF1924E - AMD  - 3D model - BGA - FLGF1924
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XCVU11P-2FLGF1924E Details

  • Manufacturer Part Number:

    XCVU11P-2FLGF1924E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1924

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1924

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Number of CLBs:

    162000

  • Number of Inputs:

    624

  • Number of Logic Cells:

    2835000

  • Number of Outputs:

    624

  • Number of Terminals:

    1924

  • Operating Temperature-Max:

    100 °C

  • Organization:

    162000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1924,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.24 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    45 mm

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XCVU11P-2FLGF1924E Overview

Use the download button to access the XCVU11P-2FLGF1924E schematic symbol, PCB footprint, and 3D model.
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Part Image XCVU11P-2FLGF1924I AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 2835000-Cell, PBGA1924