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XCVU13P-2FLGA2577I - AMD

Description: Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 448 514867200 3780000 2577-BBGA, FCBGA

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XCVU13P-2FLGA2577I - AMD PCB footprint - BGA - BGA - FLGA2577
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XCVU13P-2FLGA2577I - AMD  - 3D model - BGA - FLGA2577
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XCVU13P-2FLGA2577I Details

  • Manufacturer Part Number:

    XCVU13P-2FLGA2577I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2577

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2577

  • Length:

    52.5 mm

  • Number of CLBs:

    216000

  • Number of Inputs:

    832

  • Number of Logic Cells:

    3780000

  • Number of Outputs:

    832

  • Number of Terminals:

    2577

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    216000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2577,51X51,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.24 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    52.5 mm

XCVU13P-2FLGA2577I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU13P-2FLGA2577I is approximately 25W, but this can vary depending on the specific design and operating conditions.
  • AMD recommends using a clocking scheme that includes a clock generator, clock distribution network, and clock domain crossing (CDC) logic to ensure reliable clocking. The XCVU13P-2FLGA2577I has built-in clocking resources, such as the Mixed-Mode Clock Manager (MMCM) and the Phase-Locked Loop (PLL), that can be used to implement a reliable clocking scheme.
  • To optimize your design for power consumption, AMD recommends using power-aware design techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, using the Vivado Design Suite's power analysis and optimization tools can help identify areas of the design that can be optimized for power consumption.
  • To ensure signal integrity in your design, AMD recommends using signal integrity analysis tools, such as the Vivado Design Suite's signal integrity analysis tool, to identify potential signal integrity issues. Additionally, using techniques such as differential signaling, shielding, and termination can help mitigate signal integrity issues.
  • The maximum operating temperature of the XCVU13P-2FLGA2577I is 100°C, but it's recommended to operate the device at a temperature below 85°C for optimal performance and reliability.

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XCVU13P-2FLGA2577I Overview

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Part Image XCVU13P-2FLGA2577E AMD

Field Programmable Gate Array, 216000 CLBS, 3780000-Cell, PBGA2577

Part Image XCVU13P-2FLGA2577I AMD Xilinx

Field Programmable Gate Array, 216000 CLBS, 3780000-Cell, PBGA2577