XCVU23P-3VSVA1365E - AMD

XCVU23P-3VSVA1365E Details

• Manufacturer Part Number:

  XCVU23P-3VSVA1365E

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-1365

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  10

• JESD-30 Code:

  S-PBGA-B1365

• Length:

  35 mm

• Number of CLBs:

  128700

• Number of Inputs:

  364

• Number of Logic Cells:

  2252250

• Number of Outputs:

  364

• Number of Terminals:

  1365

• Operating Temperature-Max:

  100 °C

• Organization:

  128700 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA1365,37X37,36

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  240

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  4.6 mm

• Supply Voltage-Max:

  0.927 V

• Supply Voltage-Min:

  0.873 V

• Supply Voltage-Nom:

  0.9 V

• Surface Mount:

  YES

• Technology:

  16 nm

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.92 mm

• Terminal Position:

  BOTTOM

• Width:

  35 mm