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XCZU11EG-1FFVC1156I - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSOC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 500MHz, 600MHz, 1.2GHz 1156-FCBGA (35x35)

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PCB Footprints
XCZU11EG-1FFVC1156I - AMD PCB footprint - BGA - BGA - FFVC1156
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XCZU11EG-1FFVC1156I - AMD  - 3D model - BGA - FFVC1156
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XCZU11EG-1FFVC1156I Details

  • Manufacturer Part Number:

    XCZU11EG-1FFVC1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1156

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU11EG-1FFVC1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU11EG-1FFVC1156I is approximately 12W, but it can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling (DVFS).
  • The maximum operating temperature of the XCZU11EG-1FFVC1156I is 100°C (industrial grade) or 125°C (extended temperature range).
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where possible. Additionally, follow the PCB design guidelines provided by AMD.
  • The maximum bandwidth of the XCZU11EG-1FFVC1156I's PCIe interface is x8 Gen3, which provides a bandwidth of up to 9850 MB/s.

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XCZU11EG-1FFVC1156I Overview

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