Part Image

XCZU11EG-1FFVC1760E - AMD

Description: IC FPGA 512 I/O 1760FCBGA

Download XCZU11EG-1FFVC1760E Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XCZU11EG-1FFVC1760E - AMD PCB footprint - BGA - BGA - FVC1760
click to zoom
3D Models
XCZU11EG-1FFVC1760E - AMD  - 3D model - BGA - FVC1760
click to zoom

XCZU11EG-1FFVC1760E Details

  • Manufacturer Part Number:

    XCZU11EG-1FFVC1760E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1760

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU11EG-1FFVC1760E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU11EG-1FFVC1760E is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, use low-power modes, and optimize the design for minimal dynamic power consumption.
  • The maximum operating temperature range for the XCZU11EG-1FFVC1760E is -40°C to 100°C, but it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, add termination resistors, use differential signaling, and follow the PCB design guidelines provided by AMD.
  • The maximum bandwidth of the XCZU11EG-1FFVC1760E's PCIe interface is 16 GT/s, which translates to approximately 985 MB/s per lane, with a maximum of 16 lanes.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XCZU11EG-1FFVC1760E Overview

Use the download button to access the XCZU11EG-1FFVC1760E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XCZU1, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

Parts related to XCZU11EG-1FFVC1760E

Showing 0 results