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XCZU11EG-1FFVC1760I - AMD

Description: SoC FPGA XCZU11EG-1FFVC1760I

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XCZU11EG-1FFVC1760I - AMD PCB footprint - BGA - BGA - FVC1760
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XCZU11EG-1FFVC1760I - AMD  - 3D model - BGA - FVC1760
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XCZU11EG-1FFVC1760I Details

  • Manufacturer Part Number:

    XCZU11EG-1FFVC1760I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1760

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU11EG-1FFVC1760I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU11EG-1FFVC1760I is approximately 25W, but it can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and optimize the design for low power using techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The maximum operating temperature of the XCZU11EG-1FFVC1760I is 100°C (industrial grade) or 125°C (extended industrial grade), but it's recommended to operate within the specified temperature range for optimal performance and reliability.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where possible. Additionally, follow the PCB design guidelines and use a high-quality PCB material.
  • The maximum bandwidth of the XCZU11EG-1FFVC1760I's PCIe interface is x8 Gen3, which provides a bandwidth of up to 9850 MB/s.

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XCZU11EG-1FFVC1760I Overview

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