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XCZU11EG-2FFVC1760E - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)

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XCZU11EG-2FFVC1760E - AMD PCB footprint - BGA - BGA - FFVA1760
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XCZU11EG-2FFVC1760E Details

  • Manufacturer Part Number:

    XCZU11EG-2FFVC1760E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B1760

  • JESD-609 Code:

    e1

  • Length:

    42.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    3.71 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    42.5 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU11EG-2FFVC1760E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU11EG-2FFVC1760E is approximately 12W, depending on the specific use case and configuration.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies, voltage, and logic utilization. Additionally, consider using the AMD's Power Management Framework (PMF) to dynamically adjust power consumption.
  • The maximum operating temperature range for the XCZU11EG-2FFVC1760E is -40°C to 100°C, with a junction temperature of up to 125°C.
  • To ensure signal integrity, use the Xilinx Signal Integrity (SI) analysis tool, follow PCB design guidelines, and consider using differential signaling, termination, and shielding. Additionally, use the FPGA's built-in features, such as signal conditioning and equalization.
  • The maximum bandwidth of the XCZU11EG-2FFVC1760E's high-speed transceivers is up to 32.75 Gbps, depending on the specific transceiver type and configuration.

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XCZU11EG-2FFVC1760E Overview

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