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XCZU11EG-2FFVC1760I - AMD

Description: IC SOC CORTEX-A53 1760FCBGA

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XCZU11EG-2FFVC1760I - AMD PCB footprint - BGA - BGA - FVC1760
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XCZU11EG-2FFVC1760I - AMD  - 3D model - BGA - FVC1760
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XCZU11EG-2FFVC1760I Details

  • Manufacturer Part Number:

    XCZU11EG-2FFVC1760I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1760

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1760

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1760

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU11EG-2FFVC1760I Frequently Asked Questions (FAQs)

  • The recommended PCB layout and stackup for the XCZU11EG-2FFVC1760I can be found in the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ FPGA PCB Design and Pin Planning Guide (UG583). These guides provide detailed information on PCB layout, layer stackup, and signal routing to ensure optimal signal integrity.
  • To optimize power consumption and thermal management, refer to the Xilinx Power Estimation and Optimization Guide (UG786) and the Zynq UltraScale+ FPGA Power Management Guide (UG584). These guides provide guidance on power estimation, optimization techniques, and thermal management strategies for the XCZU11EG-2FFVC1760I.
  • The recommended clocking and reset strategies for the XCZU11EG-2FFVC1760I can be found in the Xilinx Clocking Wizard Guide (UG472) and the Zynq UltraScale+ FPGA Clocking and Reset Guide (UG585). These guides provide detailed information on clocking architectures, clock domain crossing, and reset strategies to ensure reliable and efficient system operation.
  • To ensure signal integrity and reduce EMI, refer to the Xilinx Signal Integrity Guide (UG582) and the Zynq UltraScale+ FPGA EMI and Signal Integrity Guide (UG586). These guides provide guidance on signal integrity analysis, PCB design considerations, and EMI mitigation techniques for the XCZU11EG-2FFVC1760I.
  • The recommended design flows and tools for developing and verifying designs for the XCZU11EG-2FFVC1760I can be found in the Xilinx Vivado Design Suite User Guide (UG903) and the Zynq UltraScale+ FPGA Design and Verification Guide (UG587). These guides provide detailed information on design flows, tool usage, and verification methodologies for the XCZU11EG-2FFVC1760I.

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XCZU11EG-2FFVC1760I Overview

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