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XCZU15EG-1FFVB1156E - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 500MHz, 600MHz, 1.2GHz 1156-FCBGA (35x35)

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XCZU15EG-1FFVB1156E - AMD PCB footprint - BGA - BGA - FFVB1156
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XCZU15EG-1FFVB1156E - AMD  - 3D model - BGA - FFVB1156
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XCZU15EG-1FFVB1156E Details

  • Manufacturer Part Number:

    XCZU15EG-1FFVB1156E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1156

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU15EG-1FFVB1156E Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in their documentation, including the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ PCB Design and Pin Planning Guide (UG583). Additionally, AMD recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques such as clock gating, dynamic voltage and frequency scaling, and use low-power modes. For thermal management, ensure good airflow, use thermal interfaces (e.g., heat sinks, thermal tape), and consider using a thermal management IC.
  • The recommended PLL settings and clocking architecture depend on the specific application and requirements. AMD provides guidelines and recommendations in their documentation, including the Zynq UltraScale+ Clocking and PLL User Guide (UG583). It's essential to carefully plan and implement the clocking architecture to ensure proper device operation and minimize jitter and skew.
  • To ensure reliable and secure boot and configuration, use a secure boot mechanism such as AMD's Secure Boot and Authentication (SBA) feature. Implement a robust boot process using a trusted boot mechanism, and use encryption and authentication to protect the FPGA's configuration data.
  • To implement high-speed interfaces successfully, follow AMD's guidelines and recommendations for signal integrity, PCB layout, and interface-specific settings. Use the Xilinx Vivado Design Suite to implement and optimize the interfaces, and ensure proper signal termination, routing, and clocking.

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XCZU15EG-1FFVB1156E Overview

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