- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for XCZU15EG-2FFVB1156I
- Part Number XCZU15EG-2FFVB1156I
- Manufacturer AMD
- Pin Count 1156
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - FFVB1156 Flip-Chip, Fine-Pitch BGA
- Released Date Apr 24, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XCZU15EG-2FFVB1156I Details
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Manufacturer Part Number:
XCZU15EG-2FFVB1156I
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
FCBGA-1156
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Country Of Origin:
Taiwan
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HTS Code:
8542.31.00.30
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
19
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JESD-30 Code:
R-PBGA-B1156
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JESD-609 Code:
e1
XCZU15EG-2FFVB1156I Frequently Asked Questions (FAQs)
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The recommended PCB layout and stackup for optimal signal integrity can be found in the Xilinx Zynq UltraScale+ PCB Design Guide (UG583). It provides guidelines for PCB layout, layer stackup, and routing to ensure optimal signal integrity and minimize signal degradation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption based on your design. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, use the device's built-in power management features, such as the Power Management Unit (PMU) and the Dynamic Voltage and Frequency Scaling (DVFS) feature.
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Thermal management is critical for the XCZU15EG-2FFVB1156I. Ensure good airflow around the device, and use thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink. The Xilinx Thermal Management Guide (UG586) provides guidelines for thermal design and management.
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To ensure reliable boot and configuration, use a reliable boot mechanism such as a boot flash or a secure boot mechanism. Implement a robust configuration mechanism, such as using a configuration flash or a secure configuration mechanism. Additionally, use the device's built-in features, such as the Boot and Configuration Interface (BCI) and the Secure Boot feature.
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To minimize EMI and ensure EMC, follow the guidelines in the Xilinx EMI and EMC Design Guide (UG585). Use proper PCB layout and routing techniques, and implement EMI-reducing features such as spread spectrum clocking and EMI filters. Ensure that the system meets the relevant EMC standards and regulations.
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XCZU15EG-2FFVB1156I Overview
Use the download button to access the XCZU15EG-2FFVB1156I schematic symbol, PCB footprint, and 3D model.
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