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XCZU19EG-1FFVB1517E - AMD

Description: SoC FPGA XCZU19EG-1FFVB1517E

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PCB Footprints
XCZU19EG-1FFVB1517E - AMD PCB footprint - BGA - BGA - FFVB1517
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XCZU19EG-1FFVB1517E - AMD  - 3D model - BGA - FFVB1517
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XCZU19EG-1FFVB1517E Details

  • Manufacturer Part Number:

    XCZU19EG-1FFVB1517E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1517

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1517

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU19EG-1FFVB1517E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU19EG-1FFVB1517E is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCZU19EG-1FFVB1517E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • Yes, the XCZU19EG-1FFVB1517E is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its robust design, error correction mechanisms, and compliance with various industry standards (e.g., DO-254, IEC 61508).
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guide, use the Vivado Design Suite's signal integrity analysis tools, and consider using the built-in signal conditioning features, such as input/output delay compensation and slew rate control.

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XCZU19EG-1FFVB1517E Overview

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