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XCZU21DR-2FFVD1156I - AMD

Description: FPGA Zynq UltraScale+ 930300 Cells 775MHz 16nm 0.85V 1156-Ball BGA

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PCB Footprints
XCZU21DR-2FFVD1156I - AMD PCB footprint - BGA - BGA - FFVD1156
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3D Models
XCZU21DR-2FFVD1156I - AMD  - 3D model - BGA - FFVD1156
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XCZU21DR-2FFVD1156I Details

  • Manufacturer Part Number:

    XCZU21DR-2FFVD1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1156

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

XCZU21DR-2FFVD1156I Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in the UG583 document. It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet thermal requirements.
  • Use the Xilinx Power Estimator (XPE) tool to estimate power consumption. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use the built-in thermal management features like temperature sensors and thermal shutdown.
  • The ARM Cortex-A53 processors have limitations on cache coherence, memory bandwidth, and interrupt handling. Ensure you understand these limitations and consider using the processors for control plane functions, while offloading compute-intensive tasks to the FPGA fabric.
  • Use the AMD Secure Boot mechanism, which provides a secure boot process and firmware authentication using cryptographic techniques like RSA and SHA. Implement secure key storage and management using the FPGA's built-in security features.
  • Use the AMD Vivado Design Suite's built-in debugging tools, such as the Vivado Logic Analyzer and the Vivado Serial I/O Debugger. Implement testbenches and simulation models to verify your design before prototyping.

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XCZU21DR-2FFVD1156I Overview

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