XCZU27DR-2FSVG1517I - AMD

XCZU27DR-2FSVG1517I Details

• Manufacturer Part Number:

  XCZU27DR-2FSVG1517I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-1517

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  19

• JESD-30 Code:

  S-PBGA-B1517

• Length:

  40 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  53160

• Number of Inputs:

  561

• Number of Logic Cells:

  930300

• Number of Outputs:

  561

• Number of Terminals:

  1517

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  53160 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA1517,39X39,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  240

• Programmable Logic Type:

  FPGA SOC

• Seated Height-Max:

  4.01 mm

• Supply Voltage-Max:

  0.876 V

• Supply Voltage-Min:

  0.825 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  40 mm