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XCZU3CG-1SFVC784I - AMD

Description: XILINX - XCZU3CG-1SFVC784I - MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-784

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PCB Footprints
XCZU3CG-1SFVC784I - AMD PCB footprint - BGA - BGA - SFVC784
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3D Models
XCZU3CG-1SFVC784I - AMD  - 3D model - BGA - SFVC784
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XCZU3CG-1SFVC784I Details

  • Manufacturer Part Number:

    XCZU3CG-1SFVC784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU3CG-1SFVC784I Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in their documentation, including the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ PCB Design and Pin Planning Guide (UG583). Additionally, AMD offers a PCB design review service to ensure optimal signal integrity.
  • AMD provides power estimation and thermal management guidelines in their documentation, including the Xilinx Power Estimator (XPE) tool and the Zynq UltraScale+ Power Management Guide (UG580). Engineers can also use the AMD-provided thermal models and simulation tools to optimize their design.
  • AMD provides clocking and reset guidelines in their documentation, including the Xilinx Clocking Wizard (UG472) and the Zynq UltraScale+ Clocking and Reset Guide (UG579). Engineers should follow these guidelines to ensure proper clock domain crossing and reset synchronization.
  • AMD provides secure boot and firmware authentication guidelines in their documentation, including the Xilinx Secure Boot and Authentication Guide (UG578). Engineers can use the AMD-provided security features, such as the Boot Header and Authentication Module, to ensure secure boot and firmware authentication.
  • AMD provides documentation on the integrated processors, including the Zynq UltraScale+ Processing System Technical Reference Manual (UG585) and the ARM Cortex-A53 and R5 processor documentation. Engineers should be aware of the processing system's limitations, such as cache coherence and interrupt handling, and consider these factors when designing their system.

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XCZU3CG-1SFVC784I Overview

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