Part Image

XCZU3EG-1SFVC784E - AMD

Description: XILINX - XCZU3EG-1SFVC784E - MPSOC, ARM CORTEX-A53, 1.5GHZ, FCBGA-784

Download XCZU3EG-1SFVC784E Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XCZU3EG-1SFVC784E - AMD PCB footprint - BGA - BGA - SFVC784
click to zoom
3D Models
XCZU3EG-1SFVC784E - AMD  - 3D model - BGA - SFVC784
click to zoom

XCZU3EG-1SFVC784E Details

  • Manufacturer Part Number:

    XCZU3EG-1SFVC784E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B784

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU3EG-1SFVC784E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU3EG-1SFVC784E is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
  • The XCZU3EG-1SFVC784E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • Yes, the XCZU3EG-1SFVC784E is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its robust design, error correction mechanisms, and compliance with various industry standards (e.g., DO-254, IEC 61508).
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the Vivado Design Suite's signal integrity analysis tools, and consider using the built-in signal conditioning and termination features of the FPGA.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XCZU3EG-1SFVC784E Overview

Use the download button to access the XCZU3EG-1SFVC784E schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XCZU3, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

Parts related to XCZU3EG-1SFVC784E

Showing 0 results