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XCZU43DR-2FFVG1517I - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1517-FCBGA (40x40)

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PCB Footprints
XCZU43DR-2FFVG1517I - AMD PCB footprint - BGA - BGA - FFVG1517
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XCZU43DR-2FFVG1517I - AMD  - 3D model - BGA - FFVG1517
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XCZU43DR-2FFVG1517I Details

  • Manufacturer Part Number:

    XCZU43DR-2FFVG1517I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1517

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1517,39X39,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    3.86 mm

  • Supply Voltage-Max:

    0.892 V

  • Supply Voltage-Min:

    0.808 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE RFSoC

XCZU43DR-2FFVG1517I Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in their documentation, including the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ PCB Design and Pin Planning Guide (UG583). Additionally, AMD offers a PCB layout review service to ensure optimal signal integrity.
  • AMD provides power estimation and thermal management guidelines in their documentation, including the Xilinx Power Estimator (XPE) tool and the Zynq UltraScale+ Power Management Guide (UG580). Engineers can also use the AMD-provided thermal models and simulation tools to optimize their design.
  • AMD provides clocking and reset guidelines in their documentation, including the Xilinx Clocking Wizard (CW) tool and the Zynq UltraScale+ Clocking and Reset Guide (UG579). Engineers should follow the recommended clocking and reset strategies to ensure proper device operation and minimize potential issues.
  • AMD provides secure boot and firmware authentication guidelines in their documentation, including the Xilinx Secure Boot and Authentication Guide (UG576). Engineers can use the AMD-provided security features, such as the Boot Header and Authentication mechanism, to ensure secure boot and firmware authentication.
  • AMD provides documentation on the integrated processors, including the Zynq UltraScale+ Processing System Technical Reference Manual (UG585) and the ARM Cortex-A53 and Cortex-R5 processor documentation. Engineers should be aware of the processing system's limitations, such as cache coherence and memory access, and consider these factors when designing their system.

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XCZU43DR-2FFVG1517I Overview

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