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XCZU47DR-2FFVE1156I - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1156-FCBGA (35x35)

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XCZU47DR-2FFVE1156I - AMD PCB footprint - BGA - BGA - FFVE1156
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XCZU47DR-2FFVE1156I - AMD  - 3D model - BGA - FFVE1156
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XCZU47DR-2FFVE1156I Details

  • Manufacturer Part Number:

    XCZU47DR-2FFVE1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1156

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

XCZU47DR-2FFVE1156I Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and reference design files for the XCZU47DR-2FFVE1156I. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • AMD provides power estimation tools and thermal design guides to help optimize power consumption and thermal management. Additionally, consider using power-saving features like dynamic voltage and frequency scaling, and implementing thermal management techniques like heat sinks and thermal interfaces.
  • Implement secure boot mechanisms, such as encrypted bitstreams and secure boot keys. Use AMD's Secure Boot and Anti-Tamper (SBAT) features, and consider using a secure boot loader and encrypted firmware storage.
  • Use AMD's Memory Interface Generator (MIG) tool to optimize memory interface design. Implement data transfer protocols like AXI4 or AXI4-Lite, and consider using data compression and caching techniques to improve performance.
  • Use AMD's Vivado Design Suite, which provides a comprehensive design environment for developing and verifying IP cores. Leverage AMD's IP integrator and IP catalog to accelerate design development.

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XCZU47DR-2FFVE1156I Overview

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