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XCZU47DR-2FSVG1517I - AMD

Description: SoC 64-Bit ARM Cortex-A53/ARM Cortex-R5 RISC 1333MHz/533MHz 6Core 1517-Pin FCBGA

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PCB Footprints
XCZU47DR-2FSVG1517I - AMD PCB footprint - BGA - BGA - FSVG1517
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XCZU47DR-2FSVG1517I - AMD  - 3D model - BGA - FSVG1517
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XCZU47DR-2FSVG1517I Details

  • Manufacturer Part Number:

    XCZU47DR-2FSVG1517I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1517

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    240

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

XCZU47DR-2FSVG1517I Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in their documentation, including the Xilinx PCB Design Guide (UG583) and the Zynq UltraScale+ PCB Design and Pin Planning Guide (UG583). Additionally, AMD offers a PCB layout review service to ensure optimal signal integrity.
  • AMD provides power estimation and thermal management guidelines in their documentation, including the Xilinx Power Estimator (XPE) tool and the Zynq UltraScale+ Power Management Guide (UG583). Engineers can also use the AMD-provided thermal models and simulation tools to optimize their design.
  • AMD provides clocking and reset guidelines in their documentation, including the Xilinx Clocking Wizard (UG472) and the Zynq UltraScale+ Clocking and Reset Guide (UG583). Engineers should follow these guidelines to ensure proper clock domain crossing and reset synchronization.
  • AMD provides secure boot and firmware authentication guidelines in their documentation, including the Xilinx Secure Boot and Authentication Guide (UG583). Engineers can use the AMD-provided secure boot mechanisms, such as the Boot Header and Authentication Protocol (BHAP), to ensure the authenticity and integrity of their firmware.
  • AMD provides documentation on the integrated processors, including the Zynq UltraScale+ Processing System Technical Reference Manual (UG583) and the ARM Cortex-A53 and R5 processor documentation. Engineers should be aware of the processing system's limitations, such as cache coherence and memory access, and consider these factors when designing their system.

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XCZU47DR-2FSVG1517I Overview

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