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XCZU48DR-1FFVG1517E - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 500MHz, 1.2GHz 1517-FCBGA (40x40)

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PCB Footprints
XCZU48DR-1FFVG1517E - AMD PCB footprint - BGA - BGA - FFVG1517
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3D Models
XCZU48DR-1FFVG1517E - AMD  - 3D model - BGA - FFVG1517
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XCZU48DR-1FFVG1517E Details

  • Manufacturer Part Number:

    XCZU48DR-1FFVG1517E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1517

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    RFSOC

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XCZU48DR-1FFVG1517E Overview

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