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Part Image

XCZU4EG-1SFVC784E - XILINX

Description: FPGA - Field Programmable Gate Array

Download XCZU4EG-1SFVC784E Model
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PCB Footprints
XCZU4EG-1SFVC784E - XILINX PCB footprint - BGA - BGA - SFVC784
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3D Models
XCZU4EG-1SFVC784E - XILINX  - 3D model - BGA - SFVC784
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XCZU4EG-1SFVC784E Details

  • Manufacturer Part Number:

    XCZU4EG-1SFVC784E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FCBGA-784

  • Reach Compliance Code:

    compliant

  • ECCN Code:

    5A002.A.4

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    AMD Xilinx

  • JESD-30 Code:

    R-PBGA-B784

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

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XCZU4EG-1SFVC784E Overview

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