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XCZU4EV-1SFVC784E - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23)

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PCB Footprints
XCZU4EV-1SFVC784E - AMD PCB footprint - BGA - BGA - SFVC784
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XCZU4EV-1SFVC784E - AMD  - 3D model - BGA - SFVC784
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XCZU4EV-1SFVC784E Details

  • Manufacturer Part Number:

    XCZU4EV-1SFVC784E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B784

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU4EV-1SFVC784E Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in the UG583 document, which includes guidelines for signal integrity, power distribution, and thermal management.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Implement a secure boot process, use encryption and authentication mechanisms, and follow AMD's SecureIP guidelines to protect IP and prevent unauthorized access.
  • Follow AMD's thermal management guidelines, use thermal simulation tools, and implement thermal monitoring and mitigation techniques such as thermal throttling and cooling solutions.
  • Consult AMD's radiation-hardened and high-reliability FPGA documentation, and consider factors such as total ionizing dose (TID), single-event effects (SEEs), and latchup protection.

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XCZU4EV-1SFVC784E Overview

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