- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for XCZU6EG-1FFVB1156I
- Part Number XCZU6EG-1FFVB1156I
- Manufacturer AMD
- Pin Count 1156
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - FFVB1156_2026
- Released Date Jun 22, 2026
- Last Modified Date Jun 22, 2026 12:29 PM UTC
- Pinout / Pin List Click Here (Member Only)
XCZU6EG-1FFVB1156I Details
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Manufacturer Part Number:
XCZU6EG-1FFVB1156I
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
FCBGA-1156
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Country Of Origin:
Taiwan
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HTS Code:
8542.31.00.30
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
19
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JESD-30 Code:
R-PBGA-B1156
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JESD-609 Code:
e1
XCZU6EG-1FFVB1156I Frequently Asked Questions (FAQs)
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The maximum power consumption of the XCZU6EG-1FFVB1156I is approximately 12W, but this can vary depending on the specific application, clock frequency, and usage of the device.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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The maximum operating temperature of the XCZU6EG-1FFVB1156I is 100°C (industrial grade) or 125°C (extended temperature range).
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To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance routing, and implement signal termination and buffering as needed. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity.
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The maximum clock frequency supported by the XCZU6EG-1FFVB1156I is 550 MHz, but this can vary depending on the specific application and device configuration.
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XCZU6EG-1FFVB1156I Overview
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