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XCZU6EG-1FFVC900I - AMD

Description: IC SOC CORTEX-A53 900FCBGA

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XCZU6EG-1FFVC900I - AMD - PCB symbol
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PCB Footprints
XCZU6EG-1FFVC900I - AMD PCB footprint - BGA - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU6EG-1FFVC900I - AMD - 3D model - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU6EG-1FFVC900I Details

  • Manufacturer Part Number:

    XCZU6EG-1FFVC900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B900

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU6EG-1FFVC900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU6EG-1FFVC900I is approximately 12W, but this can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components, reduce clock frequencies, use power-gating, and implement dynamic voltage and frequency scaling (DVFS).
  • The maximum operating temperature range of the XCZU6EG-1FFVC900I is -40°C to 100°C, but it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, implement proper termination, and use the built-in signal integrity analysis tools to identify potential issues.
  • The maximum bandwidth of the XCZU6EG-1FFVC900I's PCIe interface is x8 Gen3, which provides a bandwidth of up to 9850 MB/s.

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XCZU6EG-1FFVC900I Overview

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